3D ps Laser Micro Marker

Keywords: 3D ps Laser Micro Marker

Aug 29, 2020 View: 2136 Data Sheet

3D pico-second laser micro processing system consists of a pico-second laser dynamic focusing system 2D scanning system external vacuum system and precision control.

Online submission +65 63167112 sales@sintec.sg

3D pico-second laser micro processing system consists of a pico-second laser, dynamic focusing system, 2D scanning system, external vacuum system and precision control. The system has the features on high peak power and high speed scanning, which result in high speed dynamic-focusing marking, engraving and micro cutting. The vacuum system makes the processing cleaner. The system is suitable for clean and precision marking and cutting.

Features:

MW peak laser power
7days/24hours efficient operation
±32mm large field dynamic focusing
As high position speed as 10.0m/s
RTC5stabel control

Main Technical Parameters

Laser
Average power	>10W (other power levels available upon request)
Laser wavelength	1064nm
Pulse width	<10ps
Pulse repetition rate	100kHz-1000kHz
Laser beam pointing	<50μrad
Beam diameter	≤2mm
Beam divergence angle	≤3mrad
Pulse stability	≤2%rms
Long-time operation stability	≤3%
Operation temperature	18-35℃
Cooling	Water
Polorisation	Horizontal, >100:1
Dynamic Focusing System
Marking field	110x110 mm2
Z-axis adjustable range	±32mm
Focused spot diameter	<35 μm
Scanning Systems
Laser wavelength	1064nm
Allowed max. laser power	150W @1064nm
Typical scanning field	110x110mm
Typical focused beam diameter	32μm
Marking speed	2.0m/s
Position speed	10.0m/s
Power supply	±15V DC, max 2A
Dimension	114x96.5x94 mm
Weight	1.9 kg

Remark: the customer can choose any pico-second lasers or femto-second lasers from our lists. We also can design the systems according to your specific requirements on the lasers, scan heads etc. Please contact us to discuss your needs.

Applications:

Precision laser marking
Processing of glass, sapphire, LCD display and fragile materials
Processing of heart stent
Semiconductor and photovoltaic industry
3D fabrication and engraving
Flexible PCB boards’ marking

Upon request, we can use different lasers with different laser wavelength such as 532/355nm, different pulse width from ns to fs, different laser power from 4W to 100W.

Data Sheet

Online submission

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